EKF CP5-GLAM Compact PCI New Technologies Carrier Board

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PRODUCT DETAILS

Form FactorSingle size CompactPCI style Eurocard (160x100mm2)Front panel width 4HP (20.3mm)CompactPCI®32-bit33MHzSuitable for CPCI backplanes with +5V or +3.3V VIO (J1 w/o key)Ready for usage within PXI® systemsPCIe Mini Card2 x PCI Express Mini Card socketsUIM ports wired to on-board SIM connectors (hinge style)Suitable for WLAN, GSM, WiMax, Turbo Memory and other PCIe Mini CardsSuitable for USB and PCI Express Mini CardsAntenna Connectors2 x SMA/RP connectors available from the front panel, wired to on-board U.FL receptacles, suitable for double ended U.FL plug cable assemblies from Mini Card to CP5-GLAM boardup to 6 x SMA/RP front panel connectors optionally available when ExpressCard slot is not populated (MIMO solutions)USB Solid State Drive (SSD)2 x 2.00mm Pin header provided for low profile industrial USB SSD module, e.g. Intel, M-Systems, STEC (8GB as of current)ExpressCard SlotFront panel access, push-push mechanicsSuitable for 54mm and 34mm cardsSuitable for USB and PCI Express cardsElectronic power switchIndividual card retention solution for ruggedized systems available from EKFExtended ExpressCards limited to 54mm widthMain ComponentsPCI to PCI bridge (CompactPCI frontend to local PCI)PCI to PCI Express bridgePCI to USB 2.0 host controller, 5 portPCI Express packet switch, 4-laneThermal ConditionsEnvironmental ConditionsOperating temperature: 0°C ... +70°CStorage temperature: -40°C ... +85°C, max. gradient 5°C/minHumidity 5% ... 95% non condensingAltitude -300m ... +3000mShock 15g 0.33ms, 6g 6msVibration 1g 5-2000HzEC RegulationsEN55022, EN55024, EN60950-1 (UL60950-1/IEC60950-1)2002/95/EC (RoHS)MTBFtbdTypical Power Requirements+5.0V 700mA max. (varies with module assembly)+3.3V 1.6A max. (varies with module assembly)